Shenzheng Weifu Circuit Technology Co.Ld
Shenzheng Weifu Circuit Technology Co.Ld
Shenzheng Weifu Circuit Technology Co.Ld
Shenzheng Weifu Circuit Technology Co.Ld
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Shenzheng Weifu Circuit Technology Co. was established in 2010, is a professional production of double-sided circuit boards, multilayer circuit boards (PCB), PCBA modules, LED light source solutions integrated high-tech circuit board manufacturing and processing enterprises, in the entire circuit board and LED industry industry reputation, located in Dongguan City, Guangdong Province, Changan Wusha community in Dongguan City, Guangdong Province, adjacent to Songgang, Shenzhen, less than 5 minutes drive from the Guangzhou-Shenzhen high-speed, along the river highway, 107 national highway, 20 minutes to the Baoan International Airport, the traffic is very convenient, fully able to meet and cooperate with the modern enterprise fast-paced delivery time. The company's PCBs have passed UL certification (UL No. E466925) and ISO9001:2008 international certification, mainly producing multilayer circuit boards (2~16 layers), high Tg thick copper foil boards, electro-gold/sunken gold circuit boards, spray-tin circuit boards and customized printed circuit boards with various specific requirements. Our products are widely used in high-tech fields such as communication and telecommunication, consumer electronics, aerospace, testing and industrial control, medical equipment, electric power and energy, scientific and educational institutions and national defense applications.
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2024-04-26

Assuming that the frequency of a digital logic circuit reaches or exceeds 45MHz~50MHz, and the circuit operating above this frequency occupies a certain proportion of the entire electronic system (such as 1/3), it is usually called a high-frequency circuit (multi-layer circuit board). High frequency circuit board planning is a very chaotic planning process, and its wiring is crucial to the entire planning! First move, wiring of high and multi-layer circuit boards High frequency circuits often have high integration and high wiring density. Choosing multi-layer circuit boards is not only necessary for wiring, but also a useful means to reduce interference. In the PCBLayout stage, selecting a certain number of layers of printed circuit board scale reasonably can make full use of intermediate layers to set shielding, better achieve nearby grounding, effectively reduce parasitic inductance and shorten signal transmission length, and also significantly reduce signal interference. All of these methods are beneficial for the reliability of high-frequency circuits. There are materials showing that when using the same material, the noise of a four layer board (multi-layer circuit board) is 20dB lower than that of a double-sided board. However, there is also a problem together. The higher the number of half layers of a circuit board, the more chaotic the manufacturing process, and the higher the unit cost. This requires us to not only choose the appropriate number of layers of circuit boards when terminating PCBLayout, but also to stop reasonable equipment planning and choose the correct wiring rules to complete the planning. The second trick is to minimize the bending of the leads between the pins of high-speed electronic equipment, as much as possible It is best to choose a straight lead for high-frequency circuit wiring, which needs to be colored. A 45 degree broken line or circular arc can be used for coloring. This requirem
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