Shenzheng Weifu Circuit Technology Co.Ld
Shenzheng Weifu Circuit Technology Co.Ld
Shenzheng Weifu Circuit Technology Co.Ld
Shenzheng Weifu Circuit Technology Co.Ld
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Shenzheng Weifu Circuit Technology Co. was established in 2010, is a professional production of double-sided circuit boards, multilayer circuit boards (PCB), PCBA modules, LED light source solutions integrated high-tech circuit board manufacturing and processing enterprises, in the entire circuit board and LED industry industry reputation, located in Dongguan City, Guangdong Province, Changan Wusha community in Dongguan City, Guangdong Province, adjacent to Songgang, Shenzhen, less than 5 minutes drive from the Guangzhou-Shenzhen high-speed, along the river highway, 107 national highway, 20 minutes to the Baoan International Airport, the traffic is very convenient, fully able to meet and cooperate with the modern enterprise fast-paced delivery time. The company's PCBs have passed UL certification (UL No. E466925) and ISO9001:2008 international certification, mainly producing multilayer circuit boards (2~16 layers), high Tg thick copper foil boards, electro-gold/sunken gold circuit boards, spray-tin circuit boards and customized printed circuit boards with various specific requirements. Our products are widely used in high-tech fields such as communication and telecommunication, consumer electronics, aerospace, testing and industrial control, medical equipment, electric power and energy, scientific and educational institutions and national defense applications.
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2024-05-07

Today we bring you a complete version of the production process for circuit boards, hoping to give you a deeper understanding of circuit board production! Cutting materials Purpose: According to the requirements of the engineering data MI, cut into small pieces of production boards on large sheets that meet the requirements. Small pieces of boards that meet customer requirements Process: Large plate material → Cutting according to MI requirements → Curing plate → Rounding corner/grinding edge → Plate discharge Drilling Purpose: Based on engineering data, drill the required hole diameter at the corresponding position on the sheet metal that meets the required dimensions Process: Stacked board pins → Upper board → Drilling → Lower board → Inspection/repair Sinking copper Purpose: Copper deposition is the use of chemical methods to deposit a thin layer of copper on the wall of insulating holes Process: Rough grinding → Hanging plate → Automatic copper sinking line → Bottom plate → Immersion of% dilute H2SO4 → Thickening copper Graph transfer
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Mr. Loki

sales@viafoem.com

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