| Technical&Capabilities | |||
| Parameter | Standard Production | Mass Production | Sample |
|---|---|---|---|
| Layer | 24 | 24 | 26 |
| Min. Inner Layer Pad size (single) | 4mil (0.1mm) | 4mil (0.1mm) | 4mil (0.1mm) |
| Board thickness | 0.4–3.2mm | 0.4–3.2mm | 0.3–3.2mm |
| Min. Trace/Space | Inner Layer: 2.5mil/2.5mil Outer Layer: 3mil/3mil | Inner Layer: 2.5mil/2.5mil Outer Layer: 3mil/3mil | Inner Layer: 2.5mil/2.5mil Outer Layer: 3mil/3mil |
| Min. Mechanical Drilled Hole Size | 0.15mm | 0.15mm | 0.15mm |
| Min. Laser Drilled Hole Size | 0.1mm | 0.1mm | 0.1mm |
| Aspect Ratio | 10:1 | 10:1 | 12:1 |
| Min. Solder Dam | 3mil (75µm) | 2.5mil (64µm) | 2.5mil (64µm) |
| Min. Solder mask opening | 1mil | 2mil | 1.5mil |
| Max. Solder mask Hole Size | 0.5mm | 0.6mm | 0.6mm |
| Min. Space from hole to trace | 6mil (0.15mm) | 5.5mil (0.14mm) | 5.5mil (0.14mm) |
| Impedance control Tolerance | ±10% | ±8% | ±8% |
| HDI Stackup Capability | +3 stackup | +3 stackup | +3 stackup |
| Surface Treatment | ENIG, HASL, LF-HASL,OSP, Immersion Tin,Immerstion Silver, Gold plating, ENIPIG | ENIG, HASL, LF-HASL,OSP, Immersion Tin,Immerstion Silver, Gold plating, ENIPIG | ENIG, HASL, LF-HASL,OSP, Immersion Tin,Immerstion Silver, Gold plating, ENIPIG |
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